M. M. Tagiyev
Institute of Photoelectronics of Azerbaijan National Academy of Sciences, Baku, Republic of Azerbaijan
A study of electical and adhesive properties of transient contacts for extruded samples of Bi85Sb15 solid solutions have been conducted with alloys: 25 Bi + 50 Pb + 12,5 Сd + 12,5 Sn with Tm= 343 K (Wood’s alloy) and 57 Bi + 45 Sn with Tm = 412 K in temperature range ~77—300 K and magnetic field intensity (H) up to ~74·10 4 A/m. It is shown, that resistance of transient contacts (rk) of the extruded of Bi85Sb15 solid solution with the specified contact alloys at ~77 K is determined by the resistance of the structure the solid solution Bi85Sb15 — solid solution Bi85Sb15 , heavily doped by Pb and Sn atoms, diffused from contact alloy into near-contact area of the Bi85Sb15 solid solution. It is established, that by doping extruded samples of Bi85Sb15 solid solution with Pb atoms it is possible to achieve reduction of a transient contact resistance rk in Bi85Sb15 solid solution — contact alloy interface.
